AURUNA® 7000 is used for depositing hard gold coatings in special high-speed equipment. The weakly acidic electrolyte has a wide operating range with easy bath...
High-Speed Electrolyte for Hard Gold Deposition
AURUNA® 7000 is used for depositing hard gold coatings in special high-speed equipment. The weakly acidic electrolyte has a wide operating range with easy bath maintenance and high plating speed. No oxidation of the alloy partner iron.
AURUNA® 7000 was specifically developed for the automatic high-speed gold-plating in equipment for selective plating and continuously working reel-to-reel lines. Due to vigorous electrolyte agitation (flow, spray), it allows the working at high current densities with stable long-time behaviour. It can be also operated as a gold strike electrolyte.
The deposits are solderable, low in pores, ultra-bright, hard and abrasion-resistant. They have a constantly low contact resistance. Therefore the electrolyte is excellently suitable for the gold-plating of electronic components such as connectors, contacts and edge connectors on printed circuit boards.
Electrolytes Characteristics
Electrolyte type | Weakly acidic |
Metal content | 12 (2 - 18) g/l Au |
pH value | 4.2 - 4.6 |
Operating temperature | 55 (45 - 60) °C |
Current density range | 2 - 40 A/dm² |
Plating speed | 0.3 - 8.0 μm/min |
Anode material | Pt-Ti (type PLATINODE® Pt/Ti) |
Coating Characteristics
Coating | Gold-Iron |
Alloy composition | Approx. 99.7 wt. % Au, 0.1 - 0.4 wt. % Fe |
Colour of deposit | Yellow |
Brightness | Ultra-bright |
Hardness of deposit | 170 - 200 HV |
Max. coating thickness | 10 μm |
Density of the coating | Approx. 17 g/cm³ |
Advantages
- For use in high-speed equipment
- No oxidation of the alloy partner iron
- High plating speed
- Low-pore, solderable, hard and abrasion-resistant coatings
- ASTM B-488-01, Type I-II, Code C-D
- The coatings are RoHS compliant
Applications
- Connectors
- Electrical contacts
- Edge connectors of printed circuit boards